Electronics Forum | Fri Sep 02 11:44:59 EDT 2005 | Brian
We (ETS) are a manufacturer of reflow, curing and preheat systems and have had similar requests from customers in the past. One in particular required soldering onto an aluminum heat sink weighing approx 5 lbs. You might consider selective/robotic so
Electronics Forum | Tue Jun 20 19:15:19 EDT 2006 | grantp
Hi, What are your thoughts about the article saying that the lead will leach out of the solder joint to the last place to cool, creating a weak point? I have two worries about the report. First, is that we have always used tin lead solder, and le
Electronics Forum | Wed Aug 23 14:59:32 EDT 2006 | bill
I�ve been lurking on the forum for a while so I will take a stab at this, mainly because there is no answer I take it that you have a variety of boards being produced at the same time and are in fixtures so the conveyors don�t need to be adjusted, a
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Thu Feb 21 12:49:07 EST 2013 | deanm
We had the same problem with one of our boards with ground planes so that it required preheat using a hotplate before hand soldering. Then I learned about the Metcal MX-5000 series soldering irons. I was skeptical at first but we can now solder the s
Electronics Forum | Mon Nov 11 08:47:00 EST 2013 | mleber
Thanks guys. Here are more details. The cards are essentially the same. They use the same connectors, same footprint, the traces / layers would be comparable etc. The difference between the 2 we see is that one is laminate - Rigid Metal Clad Base, Ty
Electronics Forum | Tue Sep 28 09:16:10 EDT 1999 | Wendy Casker
| | What selective soldering products should I use for a low production rate, high-mix product line? I am looking to get rid of some hand soldering. I have seen exselect (selective soldering pot method), pillarhouse (small flow solder nozzle with rob
Electronics Forum | Thu Mar 29 07:37:45 EDT 2012 | davef
The current discussion about solder fountains has to do with copper dissolution. Broadly, copper dissolution is the weakening of copper traces where a trace and a barrel plating intersect due a loss of the copper into the solder. Longer contact time
Electronics Forum | Fri Dec 15 08:44:17 EST 2000 | DaveJ
I need some advise from the reflow experts. In your experience in nitrogen versus air reflow, what would be the differences in profile parameters? For example, if I profiled a board in nitrogen and achieved (for a particular component) ramps rates un
